System and method for cooling a computing device

ABSTRACT

A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.

BACKGROUND

Computing devices, such as computing devices may perform services. Toprovide the services, the computing devices may include hardwarecomponents and software components. The software components may utilizethe hardware components to provide the services. The hardware, whenutilized, generates heat that must be dissipated to prevent damage tothe hardware.

SUMMARY

In one aspect, a cooling system for use with a liquid to cool acomputing device. The cooling system includes a first internal heatexchanger and positioned within an enclosure of the computing device.The first internal heat exchanger is configured to receive a firstportion of the liquid, flow the first portion through the first internalheat exchanger to dissipate heat from air flowing over the firstinternal heat exchanger, and discharge the first portion. The coolingsystem further includes a first fan operable to recirculate air throughthe enclosure to absorb heat produced by a plurality of components ofthe computing device and flow the heated air over the first internalheat exchanger to dissipate the heat.

In one aspect, computing device to be cooled via a liquid. The computingdevice includes persistent storage, non-persistent storage, and acooling system. The cooling system includes a first internal heatexchanger positioned within an enclosure of the computing device. Thefirst internal heat exchanger is configured to receive a first portionof the liquid, flow the first portion through the first internal heatexchanger to dissipate heat from air flowing over the first internalheat exchanger, and discharge the first portion. The cooling systemfurther includes a first fan that recirculates air through the enclosureto absorb heat produced by the non-persistent storage and the persistentstorage and flow the heated air over the first internal heat exchangerto dissipate the heat.

In one aspect, a method of cooling a computing device. The methodincludes flowing a first portion of a liquid through a first internalheat exchanger positioned within the computing device and an externalheat exchanger positioned external to the computing device to absorbheat from the first internal heat exchanger and dissipate the heat viathe external heat exchanger. The method further includes recirculatingair within the computing device via a first fan to absorb heat fromcomponents of the computing device and dissipate the heat via the firstinternal heat exchanger.

BRIEF DESCRIPTION OF DRAWINGS

Certain embodiments of the invention will be described with reference tothe accompanying drawings. However, the accompanying drawings illustrateonly certain aspects or implementations of the invention by way ofexample and are not meant to limit the scope of the claims.

FIG. 1 shows a diagram of a computing device in accordance with one ormore embodiments of the invention.

FIG. 2 shows a diagram of a cooling system for a computing device inaccordance with one or more embodiments of the invention.

FIG. 3 shows a diagram of a cooling system for a computing device inaccordance with one or more embodiments of the invention.

FIG. 4 shows a diagram of a cooling system for a computing device inaccordance with one or more embodiments of the invention.

FIG. 5 shows a diagram of a cooling system for a computing device inaccordance with one or more embodiments of the invention.

FIG. 6 shows a diagram of a computing device in accordance with one ormore embodiments of the invention.

DETAILED DESCRIPTION

Specific embodiments will now be described with reference to theaccompanying figures. In the following description, numerous details areset forth as examples of the invention. It will be understood by thoseskilled in the art that one or more embodiments of the present inventionmay be practiced without these specific details and that numerousvariations or modifications may be possible without departing from thescope of the invention. Certain details known to those of ordinary skillin the art are omitted to avoid obscuring the description.

In the following description of the figures, any component describedwith regard to a figure, in various embodiments of the invention, may beequivalent to one or more like-named components described with regard toany other figure. For brevity, descriptions of these components will notbe repeated with regard to each figure. Thus, each and every embodimentof the components of each figure is incorporated by reference andassumed to be optionally present within every other figure having one ormore like-named components. Additionally, in accordance with variousembodiments of the invention, any description of the components of afigure is to be interpreted as an optional embodiment, which may beimplemented in addition to, in conjunction with, or in place of theembodiments described with regard to a corresponding like-namedcomponent in any other figure.

In general, embodiments of the invention relate to systems, devices, andmethods for cooling a computing device. The computing device may be acomputing device that provides computer-implemented services. Theseservices may include, for example, database services, electroniccommunication services, data storage services, etc.

The computing devices may include any number of computing componentsthat facilitate providing of the services of the computing device. Thecomputing components may include, for example, processors,non-persistent storage, persistent storage, circuit cards thatinterconnect these components, etc. When providing thecomputer-implemented services, various computing components of thecomputing device generate heat.

Embodiments of the invention may provide methods and systems to coolcomponents of computing devices. To cool the components, the coolingsystem may lower the temperature of the environment within an enclosure,such as a housing or enclosure of the computing device. For example, thecooling system may circulate air cooled via a heat exchanger through theenclosure to dissipate heat from one or more computing components,thereby cooling the computing components. As a second example, thesystem may utilize a liquid to dissipate heat from one or more computingcomponents via conduction, thereby cooling the computing components.

By doing so, a computing device cooled via a cooling system inaccordance with embodiments of the invention may be less likely toprematurely fail due to overheating and/or be more likely to meet itsservice life goal.

FIG. 1 shows a computing system (100) in accordance with one or moreembodiments of the invention. The system may include a frame (110) andany number of computing devices (e.g., 120A, 120B, 120C).

The frame (110) may be a mechanical structure that enables computingdevices (e.g., 120A, 120B, 120C) to be positioned with respect to oneanother. For example, the frame (110) may be a rack mount that enablescomputing devices (e.g., 120A, 120B, 120C) to be disposed within it. Theframe (110) may be implemented as other types of structures adapted tohouse, position, orient, and/or otherwise physically, mechanically,electrically, and/or thermally manage computing devices (e.g., 120A,120B, 120C). By managing the computing devices (e.g., 120A, 120B, 120C),the frame (110) may enable multiple computing device to be denselypacked in space without negatively impacting the operation of thecomputing system (100).

An enclosure (e.g., 130A, 130B, 130C) may be a mechanical structure forcomponents of a computing device (e.g., 120A, 120B, 120C). For example,an enclosure (e.g., 130A, 130B, 130C) may be implemented as a rackmountable enclosure (e.g., 130A, 130B, 130C) for components of acomputing device (e.g., 120A, 120B, 120C). The enclosure (e.g., 130A,130B, 130C) may be adapted to be disposed within the frame (110) and/orutilize services provided by the frame (110) and/or other devices.

Any number of components may be disposed in each of the respectiveenclosure (e.g., 130A, 130B, 130C). These components may be portions ofcomputing devices (e.g., 120A, 120B, 120C) that provide computerimplemented services. To provide services, the computing device (e.g.,120A, 120B, 120C) may utilize computing resources provided by computingcomponents. The computing components may include, for example,processors, non-persistent storage, persistent storage, special purposehardware, and/or other types of physical components that contribute tothe operation of the computing device. For additional details regardingcomputing devices, refer to FIG. 6 .

When the components provide computer-implemented services, thecomponents may generate heat. For example, the components may utilizeelectrical energy to perform computations and generate heat as abyproduct of performing the computations. If left unchecked, buildup ofheat within an enclosure may cause temperatures of the componentsdisposed within the enclosure to exceed preferred ranges.

The preferred ranges may include a nominal range in which the componentsrespectively operate (i) without detriment and/or (ii) are likely to beable to continue to operate through a predetermined service life of acomponent. Consequently, it may be desirable to maintain thetemperatures of the respective components within the preferred range(e.g., a nominal range).

When a component operates outside of the preferred range, the servicelife of the component may be reduced, the component may not be able toperform optimally (e.g., reduced ability to provide computations, higherlikelihood of error introduced into computations, etc.), and/or thecomponent may be more likely to unexpectedly fail. The component may besubject to other undesirable behavior when operating outside of thepreferred range without departing from the invention.

Turning now to FIG. 2 , in one embodiment of the invention, a computingdevice (220) may include a cooling system (200) to operate components,such as, but not limited to, persistent storage (210), non-persistentstorage (240), and processors (250), within the preferred range oftemperature. In one embodiment of the invention, the cooling system(200) includes internal heat exchangers (260A, 260B), an external heatexchanger (270), fans (280A, 280B, 280C) coupled to each heat exchanger(e.g., 260A, 260B, 270), and water blocks (290). Example heat exchangersinclude, but are not limited to, finned tube heat exchangers andmicrochannel heat exchangers. Further, although two internal heatexchangers (260A, 260B), one external heat exchanger (270), and threefans (280A, 280B, 280C) are shown, any number of internal heatexchangers, external heat exchangers, and fans may be used within thecooling system 200 without departing from the scope of the invention.

To provide cooling to the components of the computing device (220), aliquid, such as, but not limited to, distilled water, glycol, or otherliquid coolants, is circulated through the cooling system 200 as shownin FIG. 2 . Specifically, the liquid flows into the enclosure (230) andis then divided such that a first portion of the liquid flows into afirst internal heat exchanger (260A), a second portion of the liquidflows into a second internal heat exchanger (260B), and a third portionof the liquid flows into the water blocks (290). In one embodiment ofthe invention, a pump is integrated into one or both of the water blocks(290) to circulate the liquid.

The pumps that circulate the liquid through the cooling system (200) maybe controlled locally by the electronic device (220), a control systemexternal to the electronic device (220), or a combination of theelectronic device (220) and a control system externa to the electronicdevice. The operation of each pump may be based on a speed of the pump,a measured flowrate of the liquid through the cooling system (200), atemperature of one or more components (e.g., 210, 240, 250), atemperature of the liquid, a temperature within the enclosure (230) orany combination thereof.

The portions of the liquid flowing through the internal heat exchangers(260A, 260B) absorbs heat from air recirculated within the enclosure(230) via the fans (280A, 280B), thereby cooling the air and heating theliquid. The cooled air is then flowed over the components (e.g., 210,240, 250) of the computing device (220), cooling the components (e.g.,210, 240, 250) and heating the air. The heated air is then cooled againas the air is recirculated through the internal heat exchangers (260A,260B). Although FIG. 2 shows the fans (280A, 280B) coupled to theinternal heat exchangers (260A, 260B), the invention is not therebylimited. The fans (280A, 280B) may be positioned anywhere within theenclosure (230) that allows the fans (280A, 280B) to recirculate airthrough the enclosure (230).

The fans (280A, 280B) that recirculate air through the cooling system(200) may be controlled locally by the electronic device (220), acontrol system external to the electronic device (220), or a combinationof the electronic device (220) and a control system externa to theelectronic device. The operation of each fan (280A, 280B) may be basedon a speed of the fan (280A, 280B), a measured flowrate of the airrecirculating through the enclosure (230), a temperature of one or morecomponents (e.g., 210, 240, 250), a temperature of the liquid, atemperature within the enclosure (230) or any combination thereof.

The portion of the liquid flowing through the water blocks (290) absorbsheat from the components (e.g., 250) via cold plate portions of thewater blocks that are in thermal communication with the components via athermal interface material, thereby cooling the components (e.g., 250).Although two water blocks (290) are shown, the invention is not therebylimited. The cooling system (200) may include any number of components(e.g., 210, 240, 250) that are cooled via a water block (290) in thermalcommunication with the component (e.g., 210, 240, 250).

Once the portions of liquid flowing through the internal heat exchangers(260A, 260B) and the water blocks (290) absorb heat from the components(e.g., 210, 240, 250) and are discharged from the internal heatexchangers (260A, 260B) and water blocks (290), the portions of liquidare recombined within the enclosure (230) and discharged from theenclosure (230). The heated liquid then passes through an external heatexchanger (270) that transfers heat from the liquid to a cooling mediumto cool the liquid. In one embodiment of the invention, the coolingmedium is air flowed over the external heat exchanger (270) via a fan(280C). In other embodiments, the cooling medium may be a liquid, a gas,or a fluid made up of a combination of liquid and gas. Further, althougha single external heat exchanger (270) is shown in FIG. 2 , theinvention is not thereby limited. Any number of external heat exchangers(270) may be used to remove heat from the liquid circulated through theelectronic device (220). Further, the external heat exchanger (270) mayinclude a chiller, an air conditioner, or similar apparatus that coolsthe cooling medium flowing over the external heat exchanger (270) to asub-ambient temperature or the external heat exchanger (270) may be inthermal communication with a cold plate cooled by a chiller, an airconditioner, or similar apparatus.

The fan (280C) that flows air over the external heat exchanger (270) maybe controlled by the electronic device (220), a control system externalto the electronic device (220), or a combination of the electronicdevice (220) and a control system externa to the electronic device. Theoperation of each fan (280A, 280B) may be based on a speed of the fan(280A, 280B), a measured flowrate of the air recirculating through theenclosure (230), a temperature of one or more components (e.g., 210,240, 250), a temperature of the liquid, a temperature within theenclosure (230) or any combination thereof.

Turning now to FIG. 3 , in one embodiment of the invention, a computingdevice (320) may include a cooling system (300) to operate components,such as, but not limited to, persistent storage (310), non-persistentstorage (340), and processors (350) with heatsinks (not shown) inthermal communication with the processors (350), within the preferredrange of temperature. In one embodiment of the invention, the coolingsystem (300) includes internal heat exchangers (360A, 360B), an externalheat exchanger (370), fans (380A, 380B, 380C) coupled to each heatexchanger (e.g., 360A, 360B, 370), and a pump (395). Although twointernal heat exchangers (360A, 360B), one external heat exchanger(370), and three fans (380A, 380B, 380C) are shown, any number ofinternal heat exchangers, external heat exchangers, and fans may be usedwithin the cooling system 300 without departing from the scope of theinvention.

To provide cooling to the components of the computing device (320), aliquid, such as, but not limited to, distilled water, glycol, or otherliquid coolants, is circulated through the cooling system 300 as shownin FIG. 3 . Specifically, the liquid flows into the enclosure (330) andis then divided such that a first portion of the liquid flows into afirst internal heat exchanger (360A) and a second portion of the liquidflows into a second internal heat exchanger (360B.

The pump (395) that circulate the liquid through the cooling system(300) may be controlled locally by the electronic device (320), acontrol system external to the electronic device (320), or a combinationof the electronic device (320) and a control system externa to theelectronic device. The operation of each pump may be based on a speed ofthe pump, a measured flowrate of the liquid through the cooling system(300), a temperature of one or more components (e.g., 310, 340, 350), atemperature of the liquid, a temperature within the enclosure (330) orany combination thereof. Although only one pump (395) that is externalto the enclosure (330) is shown in FIG. 3 , the invention is not therebylimited. Any number of pumps (395) may be used and each pump (395) maybe positioned within or external to the enclosure (330).

The portions of the liquid flowing through the internal heat exchangers(360A, 360B) absorbs heat from air recirculated within the enclosure(330) via the fans (380A, 380B), thereby cooling the air and heating theliquid. The cooled air is then flowed over the components (e.g., 310,340, 350) of the computing device (320), cooling the components (e.g.,310, 340, 350) and heating the air. The heated air is then cooled againas the air is recirculated through the internal heat exchangers (360A,360B). Although FIG. 3 shows the fans (380A, 380B) coupled to theinternal heat exchangers (360A, 360B), the invention is not therebylimited. The fans (380A, 380B) may be positioned anywhere within theenclosure (330) that allows the fans (380A, 380B) to recirculate airthrough the enclosure (330).

The fans (380A, 380B) that recirculate air through the cooling system(300) may be controlled locally by the electronic device (320), acontrol system external to the electronic device (320), or a combinationof the electronic device (320) and a control system externa to theelectronic device. The operation of each fan (380A, 380B) may be basedon a speed of the fan (380A, 380B), a measured flowrate of the airrecirculating through the enclosure (330), a temperature of one or morecomponents (e.g., 310, 340, 350), a temperature of the liquid, atemperature within the enclosure (330) or any combination thereof.

Once the portions of liquid flowing through the internal heat exchangers(360A, 360B) absorb heat from the components (e.g., 310, 340, 350) andare discharged from the internal heat exchangers (360A, 360B), theportions of liquid are recombined within the enclosure (330) anddischarged from the enclosure (330). The heated liquid then passesthrough an external heat exchanger (370) that transfers heat from theliquid to a cooling medium to cool the liquid. In one embodiment of theinvention, the cooling medium is air flowed over the external heatexchanger (370) via a fan (380C). In other embodiments, the coolingmedium may be a liquid, a gas, or a fluid made up of a combination ofliquid and gas. Further, although a single external heat exchanger (370)is shown in FIG. 3 , the invention is not thereby limited. Any number ofexternal heat exchangers (370) may be used to remove heat from theliquid circulated through the electronic device (320). Further, theexternal heat exchanger (370) may include a chiller, an air conditioner,or similar apparatus that cools the cooling medium flowing over theexternal heat exchanger (370) to a sub-ambient temperature or theexternal heat exchanger (370) may be in thermal communication with acold plate cooled by a chiller, an air conditioner, or similarapparatus.

Turning now to FIG. 4 , in one embodiment of the invention, a computingdevice (420) may include a cooling system (400) to operate components,such as, but not limited to, persistent storage (410), non-persistentstorage (440), processors (450), and a power supply unit (“PSU”) (405)within a PSU enclosure (415) within the preferred range of temperature.In one embodiment of the invention, the cooling system (400) includesinternal heat exchangers (460A, 460B), an external heat exchanger (470),fans (480A, 480B, 480C, 480D) coupled to each heat exchanger (e.g.,460A, 460B, 470), and water blocks (490). Although two internal heatexchangers (460A, 460B), one external heat exchanger (470), and fourfans (480A, 480B, 480C, 480D) are shown, any number of internal heatexchangers, external heat exchangers, and fans may be used within thecooling system 400 without departing from the scope of the invention.

To provide cooling to the components of the computing device (420), aliquid, such as, but not limited to, distilled water, glycol, or otherliquid coolants, is circulated through the cooling system 400 as shownin FIG. 4 . Specifically, the liquid flows into the enclosure (430) andis then divided such that a first portion of the liquid flows into afirst internal heat exchanger (460A), a second portion of the liquidflows into a second internal heat exchanger (460B), and a third portionof the liquid flows into the water blocks (490). In one embodiment ofthe invention, a pump is integrated into one or both of the water blocks(490) to circulate the liquid.

The pumps that circulate the liquid through the cooling system (400) maybe controlled locally by the electronic device (420), a control systemexternal to the electronic device (420), or a combination of theelectronic device (420) and a control system externa to the electronicdevice. The operation of each pump may be based on a speed of the pump,a measured flowrate of the liquid through the cooling system (400), atemperature of one or more components (e.g., 405, 410, 440, 450), atemperature of the PSU (405), a temperature of the liquid, a temperaturewithin the enclosure (430) or any combination thereof.

The portions of the liquid flowing through the internal heat exchangers(460A, 460B) absorbs heat from air recirculated within the enclosure(430) via the fans (480A, 480B), thereby cooling the air and heating theliquid. The cooled air is then flowed over the components (e.g., 410,440, 450) of the computing device (420), cooling the components (e.g.,410, 440, 450) and heating the air. The heated air is then cooled againas the air is recirculated through the internal heat exchangers (460A,460B). Although FIG. 4 shows the fans (480A, 480B) coupled to theinternal heat exchangers (460A, 460B), the invention is not therebylimited. The fans (480A, 480B) may be positioned anywhere within theenclosure (430) that allows the fans (480A, 480B) to recirculate airthrough the enclosure (430).

The portion of the liquid flowing through the internal heat exchanger(460B) proximate the PSU also absorbs heat from air recirculated withinthe PSU enclosure (415) via a fan (480D) thereby cooling the air andheating the liquid. The cooled air is then flowed over the PSU (405),cooling the PSU (405) and heating the air. The heated air is then cooledagain as the air is recirculated through the internal heat exchanger(460B). Although FIG. 4 shows the fan (480D) coupled to the internalheat exchanger (460B), the invention is not thereby limited. The fan(480D) may be positioned anywhere within the PSU enclosure (415) thatallows the fan (480D) to recirculate air through the PSU enclosure(415).

The fans (480A, 280B, 480D) that recirculate air through the coolingsystem (400) may be controlled locally by the electronic device (420), acontrol system external to the electronic device (420), or a combinationof the electronic device (420) and a control system externa to theelectronic device. The operation of each fan (480A, 480B, 480D) may bebased on a speed of the fan (480A, 480B), a measured flowrate of the airrecirculating through the enclosure (430), a temperature of one or morecomponents (e.g., 410, 440, 450), a temperature of the PSU (405), atemperature of the liquid, a temperature within the enclosure (430) orany combination thereof.

The portion of the liquid flowing through the water blocks (490) absorbsheat from the components (e.g., 450) via cold plate portions of thewater blocks that are in thermal communication with the components via athermal interface material, thereby cooling the components (e.g., 450).Although two water blocks (490) are shown, the invention is not therebylimited. The cooling system (400) may include any number of components(e.g., 410, 440, 450) that are cooled via a water block (490) in thermalcommunication with the component (e.g., 410, 440, 450).

Once the portions of liquid flowing through the internal heat exchangers(460A, 460B) and the water blocks (490) absorb heat from the components(e.g., 410, 440, 450) and the PSU (405) and are discharged from theinternal heat exchangers (460A, 460B) and water blocks (490), theportions of liquid are recombined within the enclosure (430) anddischarged from the enclosure (430). The heated liquid then passesthrough an external heat exchanger (470) that transfers heat from theliquid to a cooling medium to cool the liquid. In one embodiment of theinvention, the cooling medium is air flowed over the external heatexchanger (470) via a fan (480C). In other embodiments, the coolingmedium may be a liquid, a gas, or a fluid made up of a combination ofliquid and gas. Further, although a single external heat exchanger (470)is shown in FIG. 4 , the invention is not thereby limited. Any number ofexternal heat exchangers (470) may be used to remove heat from theliquid circulated through the electronic device (420). Further, theexternal heat exchanger (470) may include a chiller, an air conditioner,or similar apparatus that cools the cooling medium flowing over theexternal heat exchanger (470) to a sub-ambient temperature or theexternal heat exchanger (470) may be in thermal communication with acold plate cooled by a chiller, an air conditioner, or similarapparatus.

The fan (480C) that flows air over the external heat exchanger (470) maybe controlled by the electronic device (420), a control system externalto the electronic device (420), or a combination of the electronicdevice (420) and a control system externa to the electronic device. Theoperation of each fan (480A, 480B) may be based on a speed of the fan(480A, 480B), a measured flowrate of the air recirculating through theenclosure (430), a temperature of one or more components (e.g., 410,440, 450), a temperature of the PSU (405), a temperature of the liquid,a temperature within the enclosure (430) or any combination thereof.

Turning now to FIG. 5 , in one embodiment of the invention, a computingdevice (520) may include a cooling system (500) to operate components,such as, but not limited to, persistent storage (510), non-persistentstorage (540), processors (550), and a PSU (505) within the preferredrange of temperature. In one embodiment of the invention, the coolingsystem (500) includes internal heat exchangers (560A, 560B), an externalheat exchanger (570), fans (580A, 580B, 580C) coupled to each heatexchanger (e.g., 560A, 560B, 570), and water blocks (590). Although twointernal heat exchangers (560A, 560B), one external heat exchanger(570), and three fans (580A, 580B, 580C) are shown, any number ofinternal heat exchangers, external heat exchangers, and fans may be usedwithin the cooling system 500 without departing from the scope of theinvention.

To provide cooling to the components of the computing device (520), aliquid, such as, but not limited to, distilled water, glycol, or otherliquid coolants, is circulated through the cooling system 500 as shownin FIG. 5 . Specifically, the liquid flows into the enclosure (530) andis then divided such that a first portion of the liquid flows into afirst internal heat exchanger (560A), a second portion of the liquidflows into a second internal heat exchanger (560B), and a third portionof the liquid flows into the water blocks (590). In one embodiment ofthe invention, a pump is integrated into one or both of the water blocks(590) to circulate the liquid.

The pumps that circulate the liquid through the cooling system (500) maybe controlled locally by the electronic device (520), a control systemexternal to the electronic device (520), or a combination of theelectronic device (520) and a control system externa to the electronicdevice. The operation of each pump may be based on a speed of the pump,a measured flowrate of the liquid through the cooling system (500), atemperature of one or more components (e.g., 510, 540, 550), atemperature of the PSU (505), a temperature of the liquid, a temperaturewithin the enclosure (530) or any combination thereof.

The portions of the liquid flowing through the internal heat exchangers(560A, 560B) absorbs heat from air recirculated within the enclosure(530) via the fans (580A, 580B), thereby cooling the air and heating theliquid. The cooled air is then flowed over the components (e.g., 510,540, 550) and the PSU (505) of the computing device (520), cooling thecomponents (e.g., 510, 540, 550) and the PSU (505) and heating the air.The heated air is then cooled again as the air is recirculated throughthe internal heat exchangers (560A, 560B). Although FIG. 5 shows thefans (580A, 580B) coupled to the internal heat exchangers (560A, 560B),the invention is not thereby limited. The fans (580A, 580B) may bepositioned anywhere within the enclosure (530) that allows the fans(580A, 580B) to recirculate air through the enclosure (530).

The fans (580A, 580B) that recirculate air through the cooling system(500) may be controlled locally by the electronic device (520), acontrol system external to the electronic device (520), or a combinationof the electronic device (520) and a control system externa to theelectronic device. The operation of each fan (580A, 580B) may be basedon a speed of the fan (580A, 580B), a measured flowrate of the airrecirculating through the enclosure (530), a temperature of one or morecomponents (e.g., 510, 540, 550), a temperature of the PSU (505), atemperature of the liquid, a temperature within the enclosure (530) orany combination thereof.

The portion of the liquid flowing through the water blocks (590) absorbsheat from the components (e.g., 550) via cold plate portions of thewater blocks that are in thermal communication with the components via athermal interface material, thereby cooling the components (e.g., 550).Although two water blocks (590) are shown, the invention is not therebylimited. The cooling system (500) may include any number of components(e.g., 510, 540, 550) that are cooled via a water block (590) in thermalcommunication with the component (e.g., 510, 540, 550).

Once the portions of liquid flowing through the internal heat exchangers(560A, 560B) and the water blocks (590) absorb heat from the components(e.g., 510, 540, 550) and are discharged from the internal heatexchangers (560A, 560B) and water blocks (590), the portions of liquidare recombined within the enclosure (530) and discharged from theenclosure (530). The heated liquid then passes through an external heatexchanger (570) that transfers heat from the liquid to a cooling mediumto cool the liquid. In one embodiment of the invention, the coolingmedium is air flowed over the external heat exchanger (570) via a fan(580C). In other embodiments, the cooling medium may be a liquid, a gas,or a fluid made up of a combination of liquid and gas. Further, althougha single external heat exchanger (570) is shown in FIG. 5 , theinvention is not thereby limited. Any number of external heat exchangers(570) may be used to remove heat from the liquid circulated through theelectronic device (520). Further, the external heat exchanger (570) mayinclude a chiller, an air conditioner, or similar apparatus that coolsthe cooling medium flowing over the external heat exchanger (570) to asub-ambient temperature or the external heat exchanger (570) may be inthermal communication with a cold plate cooled by a chiller, an airconditioner, or similar apparatus.

The fan (580C) that flows air over the external heat exchanger (570) maybe controlled by the electronic device (520), a control system externalto the electronic device (520), or a combination of the electronicdevice (520) and a control system externa to the electronic device. Theoperation of each fan (580A, 580B) may be based on a speed of the fan(580A, 580B), a measured flowrate of the air recirculating through theenclosure (530), a temperature of one or more components (e.g., 510,540, 550), a temperature of the PSU (505), a temperature of the liquid,a temperature within the enclosure (530) or any combination thereof.

Additionally, as discussed above, embodiments of the invention may beimplemented to cool a computing device. FIG. 6 shows a diagram of acomputing device in accordance with one or more embodiments of theinvention. The computing device (600) may include one or more computerprocessors (602), non-persistent storage (604) (e.g., volatile memory,such as random access memory (RAM), cache memory), persistent storage(606) (e.g., a hard disk, an optical drive such as a compact disk (CD)drive or digital versatile disk (DVD) drive, a flash memory, etc.), acommunication interface (612) (e.g., Bluetooth interface, infraredinterface, network interface, optical interface, etc.), input devices(610), output devices (608), and numerous other elements (not shown) andfunctionalities. Each of these components is described below.

In one embodiment of the invention, the computer processor(s) (602) maybe an integrated circuit for processing instructions. For example, thecomputer processor(s) may be one or more cores or micro-cores of aprocessor. The computing device (600) may also include one or more inputdevices (610), such as a touchscreen, keyboard, mouse, microphone,touchpad, electronic pen, or any other type of input device. Further,the communication interface (612) may include an integrated circuit forconnecting the computing device (600) to a network (not shown) (e.g., alocal area network (LAN), a wide area network (WAN) such as theInternet, mobile network, or any other type of network) and/or toanother device, such as another computing device.

In one embodiment of the invention, the computing device (600) mayinclude one or more output devices (608), such as a screen (e.g., aliquid crystal display (LCD), a plasma display, touchscreen, cathode raytube (CRT) monitor, projector, or other display device), a printer,external storage, or any other output device. One or more of the outputdevices may be the same or different from the input device(s). The inputand output device(s) may be locally or remotely connected to thecomputer processor(s) (602), non-persistent storage (604), andpersistent storage (606). Many different types of computing devicesexist, and the aforementioned input and output device(s) may take otherforms.

The problems discussed above should be understood as being examples ofproblems solved by embodiments of the invention disclosed herein and theinvention should not be limited to solving the same/similar problems.The disclosed invention is broadly applicable to address a range ofproblems beyond those discussed herein.

One or more embodiments of the invention may be implemented usinginstructions executed by one or more processors of the data managementdevice. Further, such instructions may correspond to computer readableinstructions that are stored on one or more non-transitory computerreadable mediums.

While the invention has been described above with respect to a limitednumber of embodiments, those skilled in the art, having the benefit ofthis disclosure, will appreciate that other embodiments can be devisedwhich do not depart from the scope of the invention as disclosed herein.Accordingly, the scope of the invention should be limited only by theattached claims.

What is claimed is:
 1. A cooling system for use with a liquid to cool acomputing device, the cooling system comprising: a first internal heatexchanger positioned within an enclosure of the computing device, thefirst internal heat exchanger configured to receive a first portion ofthe liquid, flow the first portion through the first internal heatexchanger to dissipate heat from air flowing over the first internalheat exchanger, and discharge the first portion; and a first fanoperable to recirculate air through the enclosure to absorb heatproduced by a plurality of components of the computing device and flowthe heated air over the first internal heat exchanger to dissipate theheat.
 2. The cooling system of claim 1, further comprising: a waterblock comprising a cold plate positionable in thermal communication witha component of the plurality of components via a thermal interfacematerial, the water block configured to receive a second portion of theliquid, flow the second portion over the cold plate, and discharge thesecond portion to dissipate heat from the component of the computingdevice.
 3. The cooling system of claim 2, wherein the component is anintegrated circuit.
 4. The cooling system of claim 2, furthercomprising: an external heat exchanger positionable external to thecomputing device, wherein the water block further comprises a pumpoperable to circulate at least the second portion through the waterblock and the external heat exchanger.
 5. The cooling system of claim 1,further comprising: a second internal heat exchanger positioned withinthe enclosure of the computing device, the second internal heatexchanger configured to receive a second portion of the liquid, flow thesecond portion through the second internal heat exchanger to dissipateheat from air flowing over the second internal heat exchanger, anddischarge the second portion.
 6. The cooling system of claim 5, furthercomprising: a second fan operable to recirculate air within a powersupply unit (“PSU”) of the computing device to absorb heat fromcomponents of the PSU and flow the heated air over the second internalheat exchanger to dissipate the heat.
 7. The cooling system of claim 6,further comprising: a third fan operable to recirculate air through theenclosure to absorb heat produced by the plurality of components of thecomputing device and flow the heated air over the second internal heatexchanger to dissipate the heat.
 8. The cooling system of claim 5,further comprising: a second fan and a third fan, the second fan andthird fan both operable to operable to recirculate air through theenclosure to absorb heat produced by a PSU of the computing device andthe plurality of components of the computing device and flow the heatedair over the second internal heat exchanger to dissipate the heat.
 9. Acomputing device to be cooled via a liquid, the computing devicecomprising: non-persistent storage; persistent storage; and a coolingsystem comprising: a first internal heat exchanger positioned within anenclosure of the computing device, the first internal heat exchangerconfigured to receive a first portion of the liquid, flow the firstportion through the first internal heat exchanger to dissipate heat fromair flowing over the first internal heat exchanger, and discharge thefirst portion; and a first fan that recirculates air through theenclosure to absorb heat produced by the non-persistent storage and thepersistent storage and flow the heated air over the first internal heatexchanger to dissipate the heat.
 10. The computing device of claim 9,further comprising: an integrated circuit, wherein the cooling systemfurther comprises a water block comprising a cold plate in thermalcommunication with the integrated circuit via a thermal interfacematerial, the water block configured to receive a second portion of theliquid, flow the second portion over the cold plate, and discharge thesecond portion to dissipate heat from the integrated circuit.
 11. Thecomputing device of claim 10, wherein the cooling system furthercomprising: an external heat exchanger positioned external to thecomputing device and the water block further comprises a pump operableto circulate at least the second portion through the water block and theexternal heat exchanger.
 12. The computing device of claim 9, furthercomprising: an integrated circuit, wherein heat produced by theintegrated circuit is dissipated via air recirculated by the first fan.13. The computing device of claim 9, wherein the cooling system furthercomprises: a second internal heat exchanger positioned within anenclosure of the computing device, the second internal heat exchangerconfigured to receive a second portion of the liquid, flow the secondportion through the second internal heat exchanger to dissipate heatfrom air flowing over the second internal heat exchanger, and dischargethe second portion.
 14. The computing device of claim 13, furthercomprising: a PSU; and wherein the cooling system further comprises: asecond fan that recirculates air within the PSU to absorb heat fromcomponents of the PSU and flow the heated air over the second internalheat exchanger to dissipate the heat.
 15. The computing device of claim14, wherein the cooling system further comprises: a third fan thatrecirculates air through the enclosure to absorb heat produced by thenon-persistent storage and the persistent storage and flow the heatedair over the second internal heat exchanger to dissipate the heat. 16.The computing device of claim 13, further comprising: a PSU; and whereinthe cooling system further comprises: a second fan and a third fan thatboth recirculate air through the enclosure to absorb heat produced bythe PSU, the non-persistent storage, and the persistent storage and flowthe heated air over the second internal heat exchanger to dissipate theheat.
 17. The computing device of claim 9, wherein the computing deviceis mountable in a rack.
 18. A method of cooling a computing device, themethod comprising: flowing a first portion of a liquid through a firstinternal heat exchanger positioned within the computing device and anexternal heat exchanger positioned external to the computing device toabsorb heat from the first internal heat exchanger and dissipate theheat via the external heat exchanger; and recirculating air within thecomputing device via a first fan to absorb heat from components of thecomputing device and dissipate the heat via the first internal heatexchanger.
 19. The method of claim 18, further comprising: flowing asecond portion of the liquid through a second internal heat exchangerpositioned within the computing device and the external heat exchangerto absorb heat from the second internal heat exchanger and dissipate theheat via the external heat exchanger; and recirculating air within a PSUof the computing device via a second fan to absorb heat from componentsof the PSU and dissipate the heat via the second internal heatexchanger.
 20. The method of claim 18, further comprising: flowing asecond portion of the liquid through a water block in thermalcommunication with an integrated circuit of the computing device and theexternal heat exchanger to absorb heat from the integrated circuit anddissipate the heat via the external heat exchanger.